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Automatic Fine & Heavy Wire Bonders

 

 

 
Hesse & Knipps

1036 Pine Street, Hamburg, PA 19526

www.hesse-knipps.us
  • Automatic Multi-purpose Dispenser for various materials.
  • Dispense Solder Paste, Silver Epoxy, Encapsulation and Underfill
  • Flip-Chip Die Bonder with Ultrasonics and Eutectic features
  • Automatic Gold and Aluminum Wire Wedge Bonders 
  • Large Table, Deep Access, Wire and Ribbon
  • Automatic Large Wire Bonders 5 mils to 20 mils
 

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Last modified: November 04, 2008