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Zymet, Inc.
7 Great Meadow Lane, East Hanover, New Jersey 07936 |
www.zymet.com |
- Zymet manufactures a wide range of highly specialized adhesives,
encapsulants, inks and coatings for use in the electronics and fiber
optics industries.
- Zymet's microelectronics adhesives include electrically conductive,
thermally conductive, and anisotropically conductive adhesives. These
products are ideally suited for die attachment, substrate attachment,
heat sink attachment and flip chip attachment.
- Zymet's microelectronics encapsulants include underfill, glob top,
and cavity-fill compounds. These products are designed for
encapsulation of flip chip, COB, COF, CSP, BGA and TCP devices.
- Zymet's microelectronics adhesives include electrically conductive,
thermally conductive and anisotropically conductive adhesives. These
products are ideally suited for die attachment, substrate attachment,
heat sink attachment and flip chip attachment.
- Zymets's micro-electronics encapsulants include underfill, blob top,
and cavity-fill compounds. There products are designed for
encapsulation of flip chip, COB, COF, CSP, BGA and TCP devices.
- Zymet has introduced an ultra-low stress thermally conductive
adhesive, TC-611. When bonding two dissimilar materials having
different coefficients of thermal expansion, the adhesive absorbs the
differential expansion and prevents the substrates from bending.
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