Glop Top and Epoxies

 

Zymet, Inc.

7 Great Meadow Lane, East Hanover, New Jersey 07936

www.zymet.com
  • Zymet manufactures a wide range of highly specialized adhesives, encapsulants, inks and coatings for use in the electronics and fiber optics industries.
  • Zymet's microelectronics adhesives include electrically conductive, thermally conductive, and anisotropically conductive adhesives. These products are ideally suited for die attachment, substrate attachment, heat sink attachment and flip chip attachment.
  • Zymet's microelectronics encapsulants include underfill, glob top, and cavity-fill compounds. These products are designed for encapsulation of flip chip, COB, COF, CSP, BGA and TCP devices.
  • Zymet's microelectronics adhesives include electrically conductive,
    thermally conductive and anisotropically conductive adhesives. These products are ideally suited for die attachment, substrate attachment, heat sink attachment and flip chip attachment.
  • Zymets's micro-electronics encapsulants include underfill, blob top, and cavity-fill compounds. There products are designed for encapsulation of flip chip, COB, COF, CSP, BGA and TCP devices.
  • Zymet has introduced an ultra-low stress thermally conductive adhesive, TC-611. When bonding two dissimilar materials having different coefficients of thermal expansion, the adhesive absorbs the differential expansion and prevents the substrates from bending.

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